![]() ![]() Single pass production for complex products.High productivity, low cost-of-ownership.High Performance with unbeatable accuracy The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for. Bare die assembly on flex/rigid circuits.Datacon 2200 evo goes PLUS! VISION ALIGNMENT INTEGRATED DISPENSER PICK & PLACE HEAD FOIL MOLDING Future Proof Equipment Datacon 2200 evo Innovative Solution for Innovative Products The Datacon 2200 evo s enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Ceramic provides a cost effective solution. Combination of bare and packaged die enabled reduced form factors. Flip chip including flux, high accuracy placement, reflow and underfill. Encapsulation / glob-top or dam and fill. Overmolding / contact stamping and forming. Die attach gold wire bonding gold or aluminum wedge bonding. Bare die on any substrate: FR4, thin board, flex, rigid flex, exotic materials. All of these processes are available for use with standard die and do not require custom die or TSVs (through-silicon vias). ISI has qualified a variety of stacked bare die techniques. depending on configuration and applicationMore info on. ![]() Optics movement with programmable positions. Special tools allow object sizes down to 5 µm. This cost- effective die bonder handles a wide range of sophisticated processes, including Indium bonding as well as extremely sensitive materials such as GaAs or GaP. ![]() ![]() It is the ideal choice for low volume production, prototyping, education and R&D where process flexibility is the key. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. FINEPLACER® lambda Flexible Sub-micron Die BonderThe FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. Bond process changes are easily achieved.More info on. The FC150 accommodates a wide variety of processes and materials, including extremely fragile materials such as GaAs and HgCdTe.Īctive leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Available as a fully automated system to level, align and bond components ranging in size from 0.2 to 100 mm, the FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesives and Fusion bonding. Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production. DATACON 2200 EVO MANUAL MANUALWith configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. depending on configuration and applicationMore info on:SET FC 150 FC150: The Most Flexible High Accuracy Die Bonder with ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. Supports wafer/substrate sizes up to 12″. Handles ultra small to very large components.įully-automated operation and assembly process. FINEPLACER® femto has the best cost – performance ratio of its class in the market. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification. This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. 12″).More info on:FINEPLACER ® femto 2 Automated Sub-micron Die Bonder The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications. The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible. FLIPJET FJ520-ULTRASONIC FLIPCHIP BONDER The Flipjet FJ520 is the latest evolution of the Hesse GmbH flipchip bonder platform. DATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. ![]()
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